Osram Unveils Innovative LED Manufacturing Techniques from InteGreat Research Initiative

A research project in Germany, led by Osram Opto Semiconductors in collaboration with six other industry and academic partners, has successfully developed innovative manufacturing techniques for small LED chips and their packaging. The “InteGreat” project, which ran from December 2014 to February 2018, focused on optimizing the manufacturing process and resulted in significant advancements such as wafer-level packaging and planar interconnect technology. A notable breakthrough was replacing traditional bond wires with thin flat metal connections, enhancing efficiency by relocating surface emitters to the package’s surface for improved luminance. Additionally, the project showcased functional full-color video wall modules with a 1mm pixel pitch, applicable for large displays and ambient lighting. Frank Singer from Osram emphasized the project’s impact on the future of LEDs and highlighted Germany’s role as a hub for scientific innovation.

Osram Unveils Innovative LED Manufacturing Techniques from InteGreat Research Initiative

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