Advanced 3D Printing with Multi-Material Digital Light Processing Technology

Researchers from Waseda University in Japan and Nanyang Technological University in Singapore have developed an innovative 3D printing process called multi-material digital light processing 3D printing (MM-DLP-3DP) for creating complex metal–plastic composite structures. This technique addresses the challenges of conventional fabrication methods, offering high design flexibility and the ability to produce intricate features for applications in smart electronics, IoT devices, and quantum computing. The MM-DLP-3DP process involves a series of steps, beginning with the preparation of active precursors for electroless plating, allowing the precise deposition of metal patterns. Demonstrations of the technique included the creation of 3D circuit boards and microstructures, showcasing its potential to advance the manufacturing of customizable, high-integrity 3D microelectronics.

Advanced 3D Printing with Multi-Material Digital Light Processing Technology

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